probe test

The main equipment used for wafer probe testing includes probe test benches, probe testers and probe test cards. These devices are tested by the test system to execute the test program.

The probe test bench can be classified as manual, semi-automatic or fully automatic probe bench, whose main task is to realize the accurate contact between the probes on the probe test card and the test pattern on each core on the wafer, which will directly affect the test results.wafer testing The position control module controls the movement of the wafer table according to the working instructions, to locate the wafer and accurately send it to the test position to realize the automated test.

The main work of the probe tester is responsible for the task of electrical testing, including the download of test and analysis programs, the ability to apply voltage and current, as well as information acquisition test research data management and other functions. During the test, the test environment system will extract the corresponding test application program according to the category of the chip under test. The test program will control the probe tester to complete the initial setup, and through the network test operating system can send out test signals, start testing the chip, collect relevant test experiment results and carry out garbage classification, and finally generate test result reports.

Probe test card is the bridge connecting the test system and the chip,wafer probe the chip consists of circuit board and probe. The circuit board part is connected to the probe tester, and the probe is in contact with the pad on the chip to directly collect the input signal or check the output value of the chip. Depending on the type of chip under test, the structure of the test card will vary, as will the number and layout of the probes on the test card.

With the rapid development of chip manufacturing technology, wafer probe test shows more and more important industrial value.probe holder However, wafer probe testing is also facing more and more challenges, such as the increase of chip area and density, resulting in the need for longer test time and more complex procedures, mechanical equipment and power supply to perform test work and monitor test results.

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