Semiconductor test probes are pivotal in chip design verification, wafer testing, and the final testing phase of finished semiconductor products. They play a central role in establishing a connection between the chip and test equipment,high voltage probe facilitating signal transmission, and holding significant importance in the quality control of semiconductor products.
1. Analysis and Testing of Probe Structure:
Probes typically comprise precision instruments, including riveted pre-pressure, needle, needle tail, and spring, forming the four basic components. Given the small size of semiconductor products, especially chips,wafer chuck probe size requirements extend to the micron level, positioning them as high-end precision electronic components. In wafer or chip testing, probes accurately connect to the pin or tin ball of the wafer or chip, facilitating conductivity, current, functionality, and aging performance tests. The gold-plated surface enhances corrosion resistance, electrical performance, stability, and durability. The structural design, such as the needle shape, and materials like tungsten or snipe copper significantly impact the probe's stability, finesse, signaling accuracy, and, consequently, the accuracy of test results.
2. Categorization and Testing of Probe Structure:
Regarding structure, common probe types include elastic probes, cantilever probes, and vertical probes. Elastic probes consist of a coil spring with ends attached to upper and lower post bolts, facilitating a conductive path.manual prober Cantilever probes provide longitudinal displacement for the probe section to avoid excessive needle pressure on the semiconductor product being tested. Vertical probe technology accommodates high-density signal contacts in a fine pitch arrangement, with the needle tip providing the necessary longitudinal displacement.
3. Probe Material Classification:
Probes can be classified based on materials such as tungsten probes, vanadium copper probes, and tungsten alloy probes. Tungsten alloy probes, known for stable contact resistance, a balance of hardness and flexibility, and resistance to deflection, are widely used due to their performance.
4. Test Probe Operating Frequency Classification:
Operating frequency categorizes probes into coaxial and ordinary types. Coaxial probes suit test environments sensitive to frequency, while ordinary probes are suitable for environments not sensitive to signal attenuation. Both types feature protective layers around the probe, with coaxial probes using copper tubes and ordinary probes often covered with insulating layers to prevent cross-wiring short circuits.
5. Position of the Probe in the Semiconductor Industry Chain:
Given the complexity of semiconductor product production, errors at any stage can lead to substandard product quality and impact final performance. Testing, therefore, plays a crucial role throughout the semiconductor product design, manufacturing, packaging, and application process. Probes, as important consumables in semiconductor testing, collaborate with testers, sorters, and probe tables to identify design and manufacturing defects, ensuring product yield, controlling costs, and guiding chip design and process improvement.
6. Impact of Probe on Semiconductor Packaging Test Link:
Probes, as fundamental equipment in semiconductor product testing, significantly affect the quality of test results, production management efficiency, and production enterprise cost accounting control systems. Quality issues, including test bandwidth, product design size, processing accuracy, load current, and durability, have crucial implications for semiconductor product testing and overall production efficiency.
