How do I test semiconductor integrated circuit lead strength?

Semiconductor IC lead ruggedness testing examines the ability of a device's leads, lead plating, lead soldering, and seals to withstand the bending stresses applied to the leads and seals. These stresses are entirely possible during actual use and assembly of the device, or when the leads are pretreated with moderate bending stresses prior to environmental testing. The following [Kejun Measurement and Control] editorial to introduce the semiconductor integrated circuit lead firmness test test procedures and technical parameters and lead firmness description!

Semiconductor integrated circuit leads as the main structural material of the integrated circuit package, the lead frame plays an important role in the circuit, its main functions are:

Connecting external circuits and transferring electrical signals;

Dissipate heat to the outside world and play the role of thermal conductivity;

Support and fix the role of the chip, its shell overall support frame structure assembled through the IC, to protect the internal components. It can be seen that the lead frame in the IC device and the role of each assembly program is huge.

Kezhun Measurement and Control multi-function push and pull tester is widely used in LED package test, IC semiconductor package test, TO package test, IGBT power module package test, optoelectronic component package test, large size PCB test, MINI panel test, large size sample test, automotive field, aerospace field, military product testing, testing of research institutions and various types of colleges and universities testing research and other applications. Applications.

Technical Parameters

Testing accuracy: ±0.1%

X-axis effective stroke: 220MM (standard model) can be customized according to needs

Y-axis effective stroke: 155MM (standard model) can be customized according to needs

Z-axis stroke: 66MM (standard model) can be customized according to needs

Platform fixture: the platform can be shared with a variety of fixtures, according to customer products customized

Operating characteristics: double rocker control machine four-axis movement, simple and fast operation.

Overall dimension: L660W355H590(MM)

Net weight: 70KG

Power supply: 220V50/60HZ.≤2KW

Air pressure: 0.4-0.6MPA

A variety of test fixtures (can be customized according to customer needs fixtures, to meet a variety of packaging test requirements)

Test program

Each lead or lead-out under test shall be subjected to a force sufficient to bend it as specified in 6.3.1 to 6.3.5. Any number of leads or all leads of a test device may be bent at the same time. Leads arranged in rows may be bent one row at a time.semiconductor testing Each lead shall be bent according to the following cycle, i.e.: bend in one direction to a specified arc and then return to the original position. All arcs should be in the same plane without restricting the activities of the lead.

1, bending direction

Test leads should be bent in the direction of the easiest to bend. If there is no easiest direction to bend, can be bent in any direction. Leads should not touch other leads when bending. If such contact is unavoidable, the test lead should be bent in the direction opposite to the specified angle, and then restored to its original position.

2, molding lead pre-processing procedures

When the usual straight leads (including double-row structure of the staggered leads) in the molding state, if the lead is coated in the lead after molding, and at least make the lead like the specified bending as a permanent deformation, the lead molding operation can be used as an acceptable pretreatment.

3, bendable and semi-bendable leads (such as flat shells and axial leads metal round shells) test procedures 3.1 Bendable leads

If the cross-sectional modulus of a lead is less than or equal to the cross-sectional modulus of a rectangular lead with a cross-section of 0.15mm x 0.51mm in the direction of the most bendable, such a lead shall be considered to be bendable. Diameter less than or equal to 0.51mm round leads should also be regarded as bendable. Bendable leads should be bent into an arc, unless otherwise specified, in the lead from the sealing part of the 3.05mm ± 0.76mm at the bending angle should be at least 45.

3.2 Semi-bendable leads

If the cross-section modulus of the lead in the direction of the most bendable than the cross-section of 0.15mm × 0.51mm rectangular lead cross-section modulus, such a lead should be regarded as semi-bendable lead.semiconductor failure analysis Semi-bendable leads may have to be bent for cartridge or other applications. Except as provided in 6.3.5, round leads with a diameter greater than 0.51 mm shall also be considered as semi-bendable leads. Unless otherwise specified, semi-bendable leads shall be bent into an arc with a bend angle of at least 30° at the end of the lead.

4, dual-row package and pin grid array package lead test procedures

Dual-row in-line package leads with more than one section modulus, the insertion of its leads are usually arranged in parallel with the bottom of the package into 90 °. Dual in-line package leads shall be bent inward at an angle sufficient to maintain a permanent 15° bend in the leads. For profiles 1 and 2, the bending angle shall be measured from the end of the lead to the first bend; for profile 3, the bending angle shall be measured from the end of the lead to the mounting plane; and for pin grid array packages, the outer row of test leads on opposite sides shall be bent at an angle sufficient (i.e., after stress removal) to maintain a permanent bend of the leads of 15°. The bending angle refers to the angle between the normal position of the leads. The bend should be made close to the mounting plane. At the end of the initial bend, the lead should be returned to near its original position.

5, rigid leads or leads to the end of the test program

If the lead wire or lead-in end is installed without bending and is not included in 63.3 or 6.3.4, it is considered to be a rigid lead wire.aotomatic prober Unless otherwise specified, devices conforming to the descriptions in this section with lead-in ends shall be operated and uninstalled in accordance with normal installation. When normal installation/uninstallation will cause damage to the lead-in (e.g., lead-in fusion welding, winding), pre-treatment is not necessary.

6, Failure Judgment

After removing the stress, magnification of 10 times to 20 times the inspection, in the lead (how to test the semiconductor IC lead firmness?).

Semiconductor integrated circuit lead firmness test is to check the device's leads, lead coating, lead soldering and sealing to withstand the bending stresses applied to the leads and seals on the ability. These stresses are entirely possible during actual use and assembly of the device, or when the leads are pretreated with moderate bending stresses prior to environmental testing.